Search
We provide quick search to the latest news, core services, applications, and corporate sustainable development, helping you obtain the required information more efficiently.
  • Semiconductors
  • Sustainable development
  • Laser
  • Auto
  • Innovation
  • R&D
  • Components
  • Polymeric materials
  • About Our Services

    test

    The extended applications of semiconductor laser technology are extensive, encompassing optical communication (high-speed transmission), sensing and LiDAR (automotive, environmental monitoring), medical (diagnosis, treatment, aesthetics), precision micro-processing (electronics, semiconductor manufacturing), data storage (optical discs), display technology, and even 3D printing (additive manufacturing). Through ultrafast laser technology such as femtosecond lasers, advanced applications such as glass micro-structuring and biomedical material modification are realized, driving the development of diversified industry development in areas like smart living and healthy lifestyles. Industrial manufacturing and micro-processing: High-precision cutting, welding, marking, surface treatment, and micro-structure processing for semiconductor manufacturing processes.

    Classification by Processing Action

    Laser cutting: Melting or vaporizing materials with a high-power beam, including flame cutting (structural steel) and fusion cutting.

    Laser marking/engraving: Creates permanent markings on material surfaces, used on anodized metals.

    Laser welding: A connection point is melted by focusing a high-power laser, suitable for metal fusion welding.

    Laser cleaning/rust removal: High-density beams instantly evaporate oil stains and rust. When laser processing is selected, fiber lasers are typically used for metals, while CO₂ or UV lasers are used for non-metals.

    test

    Future Trends: Collimation, beam shaping, and heat dissipation technologies for laser sources

    Silicon photonics technology: Using lasers to transfer optical components onto silicon substrates accelerates packaging and chip interconnection.SiPh technology generally refers to the fabrication of miniaturized chips using mature silicon wafers and semiconductor manufacturing processes to integrate numerous discrete electronic and optical components, replacing traditional optical transceiver modules. It is currently primarily used in data centers for short-distance data transmission or in long-distance fiber optic networks.